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ASME Thermal Management of Microelectronic Equipment
440 стр.
По запросу
217.80 $ (включая НДС 20%)
Разработчик:
Зарубежные/ASME
Тематика:
Описание
By Lian-Tuu Yeh and Richard C. Chu

With an increased demand on system reliability and performancecombined with the miniaturization of devices, thermal considerationhas become a crucial factor in the design of electronic packaging,from chip to system levels. This new book emphasizes the solving ofpractical design problems in a wide range of subjects related tovarious heat transfer technologies.

While focusing on understanding the physics involved in the subjectarea, the authors have provided substantial practical design dataand empirical correlations used in the analysis and design ofequipment.
The book provides the fundamentals along with a step-by-stepanalysis approach to engineering, making it an indispensablereference volume.

The authors present a comprehensive convective heat transfercatalog that includes correlations of heat transfer for variousphysical configurations and thermal boundary conditions. They alsoprovide property tables of solids and fluids. Lian-Tuu Yeh andRichard Chu are recognized experts in the field of thermalmanagement of electronic systems and have a combined 60 years ofexperience in the defense and commercial industries.