Print proceedings of the ASME International Mechanical EngineeringCongress & Exposition (IMECE2007) -
Volume 5, Electronics and Photonics
Printed collection on 60 full-length, peer-reviewed technicalpapers. Topics include:
General
Modeling and Characterization of Electronic Packages
Novel Thermal Management Solutions for Electronics Cooling
MEMS/NEMS Packaging Symposium
Symposium on Eco-Electronics
Symposium on Multiphysics Issues in Electronic/PhotonicPackaging
Symposium on Materials in Advanced Packaging
Symposium on Quality and Reliability of Electronic/PhotonicPackaging - I
Symposium on Quality and Reliability of Electronic/PhotonicPackaging - II
Symposium on Quality and Reliability of Electronic/PhotonicPackaging - III
EPPD Student Papers
Emergent problems in thermal management