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ASME Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013)-Volume 2
680 стр.
По запросу
411.60 $ (включая НДС 20%)
Разработчик:
Зарубежные/ASME
Тематика:
Описание

Focuses on R&D, manufacturing, and application for packagingand integration of electronic and photonic systems, MEMS, and NEMS,the proceedings cover the latest research and emergingtechnologies.

Printed collection on 80 full-length, peer-reviewed technicalpapers. Topics include:

  • Thermal Management
  • Data Centers and Energy Efficient Electronic Systems

ISBN #: 9780791855768
No. of pages: 680