PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERINGCONGRESS AND EXPOSITION NOVEMBER 11-16, 2001 NEW YORK,NEW YORKCollection of 37 full-length, peer-reviewed technical papers thatcover the leading edge in research and innovations in the followingmajor topic areas: Thermal and Thermo-Mechanical Issues inElectronic Packaging; Nano-and Micro-Scale Compliant Interconnectsfor Electronic Packages; Thermal Management of Packaging Problems;Wafer and Electronic Manufacturing in Semiconductor Processing;Mechanics of SMT and Photonic Structures.