(812) 309-78-59
(495) 223-46-76
ASME Packaging,Reliability and Manufacturing Issues Associated with Electronic and Photonic Products
240 стр.
По запросу
201.60 $ (включая НДС 20%)
Разработчик:
Зарубежные/ASME
Тематика:
Описание
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERINGCONGRESS AND EXPOSITION NOVEMBER 11-16, 2001 NEW YORK,NEW YORKCollection of 37 full-length, peer-reviewed technical papers thatcover the leading edge in research and innovations in the followingmajor topic areas: Thermal and Thermo-Mechanical Issues inElectronic Packaging; Nano-and Micro-Scale Compliant Interconnectsfor Electronic Packages; Thermal Management of Packaging Problems;Wafer and Electronic Manufacturing in Semiconductor Processing;Mechanics of SMT and Photonic Structures.