Proceedings of the ASME International Mechanical EngineeringCongress and Exposition, November 17-22, 2002, New Orleans,Louisiana. Collection of 73 full-length, peer-reviewed technicalpapers that cover research and innovations in the following majortopic areas: Nanotechnology;Electronic and Photonic Packaging: MEMSPackaging; Wafer Processing; Next Generation Packaging and ThermalManagement Solutions; Microelectronic Manufacturing, Reliability,and Quality Assurance Testing; 14th Symposium on SMT and PhotonicStructures; Experimental Characterization in Microelectronics;Modeling and Simulation; Computational and Experimental Studies ofThermomechanical Behavior of Telecommunications Systems;Reliability of Characterization. Electical Systems and PhotonicDesign: Mechanical Issues in Microelectronics and Photonics; StressRelated Issues in Photonic Devices and Packages; PhotonicsPackaging: Process and Reliability Issues; Mechanical Integrity ofMicroelectronic Packaging; Microelectronic Manufacturing,Reliability and Quality Assurance Testing. @By: Ganesh Subbarayanand Bahgat G. Sammakia