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BS 4584-103.2:1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits, Specification for copper foil for use in the manufacture of copper-clad base materials
14 стр.
Действует
Печатное изданиеПечатная копия
166.32 £ (включая НДС 20%)
Разработчик:
Зарубежные/BSI
ICS:
31.180 Printed circuits and boards / Печатные схемы и платы
Ключевые слова:
Metal coatings|Sampling methods|Electro-analytical methods|Printed circuits|Printed-circuit boards|Wettability|Penetration tests|Surface treatment|Printed-circuit bases|Elongation|Rolls|Mass|Packaging|Electrical conductivity|Test equipment|Grades (quality)|Coated materials|Thickness|Foil|Tensile testing|Tensile strength|Test specimens|Dimensional tolerances|Roughness (surface)|Copper|Defects|Marking|Weight measurement|Purity|Stain tests|Testing conditions|Laminates|Specimen preparation|Width|Electrical resistance