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BS EN 60191-6-20:2010
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
16 стр.
Действует
Печатная копияПечатное издание
184.46 £ (включая НДС 20%)
Разработчик:
Зарубежные/BSI
ICS:
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом
Ключевые слова:
Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Drawings, Engineering drawings, Integrated circuits, Surface mounting devices, Printed-circuit boards, Electric connectors