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BS EN 60191-6-4:2003
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of ball grid array (BGA)
20 стр.
Действует
Печатная копияПечатное издание
184.46 £ (включая НДС 20%)
Разработчик:
Зарубежные/BSI
ICS:
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом
Ключевые слова:
Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Drawings, Engineering drawings, Surface mounting devices, Integrated circuits, Semiconductor technology