Ключевые слова:
Flexible materials|Fatigue testing|Printed circuits|Thickness measurement|Bend testing|Dimensional tolerances|Coated materials|Weight (mass)|Printed-circuit bases|Dielectric strength|Permittivity|Dissipation factor|Packaging|Solderability testing|Copper|Defects|Electronic equipment and components|Polymers|Electrical resistance|Metal coatings|Density|Thickness|Surface properties|Adhesion tests|Electrical resistivity|Films (states of matter)|Dimensional changes|Dimensional measurement|Printed-circuit boards|Marking|Laminates|Flammability|Adhesive strength|Foil|Mechanical testing