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BS EN 60749-15:2003
Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices
10 стр.
Заменен
Печатная копияПечатное издание
111.89 £ (включая НДС 20%)
Разработчик:
Зарубежные/BSI
ICS:
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом
Ключевые слова:
Semiconductor devices, Integrated circuits, Electronic equipment and components, Mechanical testing, Environmental testing, Climate, Encapsulated, Soldering, Solderability testing, Thermal testing, Holes, Slots, Destructive testing