Ключевые слова:
Integrated circuits|Solderability testing|Strength of materials|Dimensional measurement|Classification systems|Specimen preparation|Accelerated testing|Pull-out tests|Mass spectrometry|Mechanical testing|Thermal-shock tests|Storage|Electrical testing|Visual inspection (testing)|Torsion testing|Low-pressure tests|Defects|Endurance testing|Test equipment|Test specimens|Electric terminals|Temperature measurement|Environmental testing|Marking|Shear testing|Leak tests|Electronic equipment and components|Bonding|Stress|Moisture measurement|Vibration testing|Radioactive tracer methods|Thermal testing|Semiconductor devices|Fire tests|Damp-heat tests|Flammability|Testing conditions