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BS EN 61190-1-3:2007
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
38 стр.
Действует
Печатная копияПечатное издание
244.94 £ (включая НДС 20%)
Разработчик:
Зарубежные/BSI
ICS:
31.190 Electronic. Including preassembled modules / Электронные компоненты в сборе. Включая предварительно собранные модули
Ключевые слова:
Electronic equipment and components, Electronic engineering, Electrical connections, Bonding, Soldering, Solders, Fluxes (materials), Bars (materials), Particulate materials, Pastes, Classification systems, Quality control, Quality assurance, Test methods