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BS EN 61190-1-3:2007+A1:2010
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
40 стр.
Заменен
Печатная копияПечатное издание
299.38 £ (включая НДС 20%)
Разработчик:
Зарубежные/BSI
ICS:
31.190 Electronic. Including preassembled modules / Электронные компоненты в сборе. Включая предварительно собранные модули
Ключевые слова:
Quality control, Quality assurance, Classification systems, Electrical connections, Test methods, Pastes, Solders, Electronic engineering, Bonding, Bars (materials), Fluxes (materials), Particulate materials, Electronic equipment and components, Soldering