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BS EN 61191-3:1999
Printed board assemblies, Sectional specification. Requirements for through-hole mount soldered assemblies
18 стр.
Заменен
Печатное изданиеПечатная копия
196.56 £ (включая НДС 20%)
Разработчик:
Зарубежные/BSI
ICS:
31.180 Printed circuits and boards / Печатные схемы и платы
Ключевые слова:
Defects|Semiconductor devices|Electrical equipment|Electronic equipment and components|Electrical components|Holes|Integrated circuits|Printed circuits|Boards|Surface properties|Wires|Microassembling|Joints|Printed-circuit boards|Soldering