(812) 309-78-59
(495) 223-46-76
IEC 60191-3B:1978 ed1.0
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Second supplement
5 стр.
Заменен
Печатная копияЭлектронный (pdf)
32.76 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом, 01.100.20 Mechanical engineering drawings / Машиностроительные чертежи
Описание
Completes IEC 60191-3 by defining in a more satisfactory manner the mounted length and width of DIL and QUIL packages and giving recommendations for the bending of terminals of QUIL packages used for the mounting of integrated circuits.It also lists the dimensions permitting the definition of the families of packages of Form 3 and Form 4.