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IEC 61188-1-2:1998 ed1.0
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
83 стр.
Отменен
Электронный (pdf)Печатная копия
401.32 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.180 Printed circuits and boards / Печатные схемы и платы
Описание
The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.