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IEC 61189-11:2013 ed1.0
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
30 стр.
Действует
Электронный (pdf)Печатная копия
114.66 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.180 Printed circuits and boards / Печатные схемы и платы
Описание
IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.