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IEC 61189-3-719:2016 ed1.0
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
22 стр.
Действует
Электронный (pdf)Печатная копия
65.52 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.180 Printed circuits and boards / Печатные схемы и платы
Описание
IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.