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IEC 61191-2:2017 ed3.0
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
33 стр.
Печатная копияЭлектронный (pdf)
327.60 CHF (включая НДС 20%)
31.240 Mechanical structures for electronic equipment / Механические конструкции электронного оборудования31.190 Electronic. Including preassembled modules / Электронные компоненты в сборе. Включая предварительно собранные модули
IEC 61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a)   the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
b)   some of the terminology used in the document has been updated;
c)   references to IEC standards have been corrected;
d)   five termination styles have been added.