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IEC 62047-25:2016 ed1.0
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
45 стр.
Действует
Печатная копияЭлектронный (pdf)
229.32 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.080.99 Other semiconductor devices / Полупроводниковые приборы прочие
Описание
IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.