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IEC 63011-2:2018 ed1.0
Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
28 стр.
Действует
Печатная копияЭлектронный (pdf)
114.66 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.200 Integrated. Including electronic chips, logical and analogue microstructures / Интегральные схемы. Микроэлектроника. Включая электронные микросхемы, логические и аналоговые микроструктуры
Описание

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.