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IEC 63068-2:2019 ed1.0
Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection
25 стр.
Действует
Электронный (pdf)Печатная копия
229.32 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.080.99 Other semiconductor devices / Полупроводниковые приборы прочие
Описание
IEC 63068-2:2019(E) provides definitions and guidance in use of optical inspection for detecting as-grown defects in commercially available 4H-SiC (Silicon Carbide) epitaxial wafers. Additionally, this document exemplifies optical images to enable the detection and categorization of the defects for SiC homoepitaxial wafers. This document deals with a non-destructive test method for the defects so that destructive methods such as preferential etching are out of scope in this document.