OVE EN IEC 62148-21:2020-03
Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 62148-21:2019) (english version)
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ICS:
33.180.20 Fibre optic interconnecting devices / Волоконно-оптические межсоединительные устройства
Описание
This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated
circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch
land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is
informative.
The purpose of this document is to specify adequately the electrical interface of PIC packages
composed of optical transmitters and receivers that enable mechanical and electrical
interchangeability of PIC packages.
circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch
land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is
informative.
The purpose of this document is to specify adequately the electrical interface of PIC packages
composed of optical transmitters and receivers that enable mechanical and electrical
interchangeability of PIC packages.
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