This part of IEC 60749 is intended to evaluate and compare drop performance of a surface
mount semiconductor device for handheld electronic product applications in an accelerated
test environment, where excessive flexure of a circuit board causes product failure. The
purpose is to standardize test methodology to provide a reproducible assessment of the drop
test performance of a surface mounted semiconductor devices while duplicating the failure
modes normally observed during product level test.
This international standard uses a strain gauge to measure the strain and strain rate of a
board in the vicinity of a component. Test method IEC 60749-37 uses an accelerometer to
measure the mechanical shock duration and magnitude applied which is proportional to the
stress on a given component mounted on a standard board. The detailed specification shall
state which test method is to be used.