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ÖVE/ÖNORM EN 62047-12:2012-08
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011) (english version)
Действует
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293.36 € (включая НДС 20%)
Разработчик:
Зарубежные/ON
ICS:
31.080.99 Other semiconductor devices / Полупроводниковые приборы прочие
Описание
This part of IEC 62047 specifies a method for bending fatigue testing using resonant vibration
of microscale mechanical structures of MEMS (micro-electromechanical systems) and
micromachines. This standard applies to vibrating structures ranging in size from 10 µm to
1 000 µm in the plane direction and from 1 µm to 100 µm in thickness, and test materials
measuring under 1 mm in length, under 1 mm in width, and between 0,1 µm and 10 µm in
thickness.
The main structural materials for MEMS, micromachine, etc. have special features, such as
typical dimensions of a few microns, material fabrication by deposition, and test piece
fabrication by means of non-mechanical machining, including photolithography. The MEMS
structures often have higher fundamental resonant frequency and higher strength than macro
structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method
with ultra high cycles (up to 1012) loadings needs to be established. The object of the test
method is to evaluate the mechanical fatigue properties of microscale materials in a short
time by applying high load and high cyclic frequency bending stress using resonant vibration.
Ключевые слова:
Halbleiterbauelement, Bauelement (Elektronik), Mikrosystem, Mikrosystemtechnik, Prüfung, Verfahren, Biegefestigkeit, Biegefestigkeitsprüfung, Ermüdungsfestigkeit, Dünnschichtwerkstoff, Verwendung, Resonanzschwingung, MEMS, Struktur, Informationstechnologie, Telekommunikation, Elektronik, Schwingfestigkeit, Begriffe, Terminologie, Prüfeinrichtung, Bauteil, Messung, Prüfdurchführung, Prüfbericht