This part of IEC 62047 specifies the adhesive testing method between micro-sized elements
and a substrate using the columnar shape of the specimens. This international standard can
be applied to adhesive strength measurement of microstructures, prepared on a substrate,
with width and thickness of 1 µm to 1 mm, respectively.
Micro-sized elements of MEMS devices are made up of laminated fine pattern films on a
substrate, which are fabricated by deposition, plating, and/or coating with photolithography.
MEMS devices include a large number of interfaces between dissimilar materials, at which
delamination occasionally occurs during fabrication or in operation. Combination of the
materials at the junction determines the adhesive strength; moreover, defects and residual
stress in the vicinity of the interface, which are changing by processing condition, strongly
affect the adhesive strength. This standard specifies the adhesive testing method for microsized-
elements in order to optimally select materials and processing conditions for MEMS
devices.
This standard does not particularly restrict test piece material, test piece size and
performance of the measuring device, since the materials and size of MEMS device
components range widely and testing machine for micro-sized materials has not been
generalized.