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BS EN 60749-20-1:2009
Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
36 стр.
Действует
Печатная копияПечатное издание
299.38 £ (включая НДС 20%)
Разработчик:
Зарубежные/BSI
ICS:
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом
Ключевые слова:
Packaging, Materials handling, Surface mounting devices, Thermal testing, Environment (working), Soldering, Labelling (process), Environmental testing, Climate, Integrated circuits, Damp-heat tests, Electronic equipment and components, Semiconductor devices, Transportation, Mechanical testing