(812) 309-78-59
(495) 223-46-76
IEC TR 60068-3-12:2007 ed1.0
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
16 стр.
Заменен
Электронный (pdf)Печатная копия
131.04 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
19.040 Environmental. Including testing equipment / Климатические испытания. Включая испытательное оборудование
Описание
Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)