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BS EN 60749-20:2009
Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
30 стр.
Действует
Печатная копияПечатное издание
257.04 £ (включая НДС 20%)
Разработчик:
Зарубежные/BSI
ICS:
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом
Ключевые слова:
Mechanical testing, Solderability testing, Soldering, Integrated circuits, Semiconductor devices, Electronic equipment and components, Environmental testing, Damp-heat tests, Surface mounting devices, Encapsulated, Thermal testing, Climate, Plastics