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ASME Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exposition on Packaging and Integration of Electronic and Photonic Systems (IPACK2011- Volume 1
802 стр.
По запросу
460.80 $ (включая НДС 20%)
Разработчик:
Зарубежные/ASME
Тематика:
Описание

Focused on R&D, manufacturing, and application for packagingand integration of electronic and photonic systems, MEMS, and NEMS,the proceedings cover the latest research and emergingtechnologies.

Printed collection on 95 full-length, peer-reviewed technicalpapers. Topics include:

  • Advanced Packaging
  • Modeling and Simulation
  • MEMS, NEMS
  • Multi Physics Based Reliability
  • Electrical
  • Emerging Technologies

ISBN No:978-0-7918-4461-8      
Total Number of Pages: 802