Proceedings of the ASME International Mechanical EngineeringCongress and Exposition, November 5-10, 2000, Orlando, Florida.Collection of 30 full-length, peer-reviewed technical papers on thefollowing major topic areas: Mechanics of SMT and photonicstructures; Alternatives to lead solder: views, concerns, andissues for use in military electronics and other harshenvironments-technical advances in lead-free interconnectiontechnologies; research and technological advances in wafer andelecctronic manufacturing: slicing of silicon wafers, lithiumniobate, piezoelectric materials, chem-mechanical polishing (CMP)and planarization to prepare wafers for micro-electronicsfabrication; cooling challenges in electronic packaging. @By: G.J.Kowalski et. al