Proceedings of the ASME International Mechanical EngineeringCongress and Exposition, November 13-19, 2004, Anaheim, California.Printed compilation consisting of 75 full-length, peer-reviewedpapers on the following topics: Electroncis and PhotonicsPackaging: Heat Transfer; Heat Transfer in Electronic Equipment;Mechanics of Surface Mount Assemblies and Photonic Structures;MEMS/NEMS Packaging; Nanoscale Materials and Mechanics forElectronic Packaging, Quality and Reliability. Electrical SystemsDesign and Photonics: Technology Transfer. Nanotechnology: Designand Fabrication Techniques; Diagnostics and Measurement Techniquesand Requirements of Standards; Engineering and Analysis of Noveland Nano Building Blocks; Fabrication and Directed and SelfAssembly Tools and Processes at Nanoscale; General; Issues Relatedto Integration Across Scale Boundaries; Modeling and ExperimentalValidation.