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ASME Proceeding of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems-Volume 1
784 стр.
По запросу
454.80 $ (включая НДС 20%)
Разработчик:
Зарубежные/ASME
Тематика:
Описание

Focused on R&D, manufacturing, and application for packagingand integration of electronic and photonic systems, MEMS, and NEMS,the proceedings cover the latest research and emergingtechnologies.

Printed collection on 89 full-length, peer-reviewed technicalpapers. Topics include:

Thermal Management

ISBN No:978-0-7918-5688-8      
Total Number of Pages: 784