This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies.

Formerly under the jurisdiction of Committee F01 on Electronics and Subcommittee F01.07 on Wire Bonding, Flip Chip, and Tape Automated Bonding, this specification was withdrawn in July 2007 in accordance with section 10.6.3.1 of the Regulations Governing ASTM Technical Committees, which requires that standards shall be updated by the end of the eighth year since the last approval date.

1.1 This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies.

1.2 This specification establishes the nominal passivation opening dimensions, nominal passivation, opening spacing, nominal corner passivation opening offset, minimum scribe guard and minimum die size for the most common input/ output counts within each technology.

1.3 This specification is extendable to other interconnection technologies if the passivation opening and spacing are adjusted in such a way that the progression is not modified.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.