(812) 309-78-59
(495) 223-46-76
ASTM F1269-13
Standard Test Methods for Destructive Shear Testing of Ball Bonds
9 стр.
Заменен
Электронный (pdf)Печатное издание
96.72 $ (включая НДС 20%)
Разработчик:
Зарубежные/ASTM
ICS:
25.160.40 Welded. Including welding position and mechanical and non-destructive testing of welded joints / Сварочные швы. Включая положение шва и механические и неразрушающие испытания сварных соединений
Сборник (ASTM):
10.04 Electronics; Declarable Substances in Materials; 3D Imaging Systems; Additive Manufacturing Technologies / Электроника; Декларируемые вещества в материалах; Системы 3D-визуализации; Аддитивные технологии производства
Тематика:
Electronics
Описание
Значение и использование

5.1 Failure of microelectronic devices is often due to the failure of an interconnection bond. The most common type of interconnection bond is the thermosonic gold or copper wire bond. A very important element of this interconnection is the first bond or ball bond. These test methods can assist in maintaining control of the process for making ball bonds. They can be used to distinguish between weak and nonadherent ball bonds, of both, and bonds that are acceptably strong.

5.2 These test methods are appropriate for on-line use in process control, for process development, for purchase specifications, and for research in support of improved yield and reliability. Since the ball shearing method tests only the first bond in a microelectronic wire bond interconnection system, it must be used in a complementary fashion5 ,6 with the wire bond pull test.3

Область применения

1.1 These test methods cover tests to determine the shear strength of a series of ball bonds made by either thermosonic or thermal compression techniques using either gold or copper wires.

Note 1Common usage at the present time considers the term “ball bond'' to include the enlarged spheriodal or nailhead portion of the wire, (produced by the flameoff/spark [EFO] and first bonding operation in the thermosonic [or thermal compression] process), and the ball bond-bonding pad interfacial-attachment area or weld interface.

1.2 These test methods cover ball bonds made with small diameter (from 18 to 76-μm (0.0007 to 0.003-in.)) gold or copper wire of the type used in integrated circuits and hybrid microelectronic assemblies, system on a chip, and so forth.

1.3 These test methods can be used only when the ball height and diameter are large enough and adjacent interfering structures are far enough away to allow suitable placement and clearance (above the bonding pad and between adjacent bonds) of the shear test ram.

1.4 These test methods are destructive. They are appropriate for use in process development or, with a proper sampling plan, for process control or quality assurance.

1.5 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Ключевые слова:
ball bonds; shear testing; wire bonding