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ASTM F638-88(1995)e1
Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding
3 стр.
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84.24 $ (включая НДС 20%)
Разработчик:
Зарубежные/ASTM
Сборник (ASTM):
10.04 Electronics; Declarable Substances in Materials; 3D Imaging Systems; Additive Manufacturing Technologies / Электроника; Декларируемые вещества в материалах; Системы 3D-визуализации; Аддитивные технологии производства
Тематика:
Electronics
Описание
Область применения

1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.

Ключевые слова:
magnesium aluminum wire; wire bonding