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BS CECC 23600-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
24 стр.
Действует
Печатное изданиеПечатная копия
275.18 £ (включая НДС 20%)
Разработчик:
Зарубежные/BSI
ICS:
31.180 Printed circuits and boards / Печатные схемы и платы
Ключевые слова:
Conformity|Approval testing|Electronic equipment and components|Detail specification|Porosity measurement|Electrical components|Organic coatings|Electrical testing|Designations|Metal coatings|Edge socket connectors|Finishes|Preferred sizes|Solderability testing|Assessed quality|Electrical equipment|Laminates|Dimensional measurement|Inspection|Visual inspection (testing)|Quality assurance systems|Surface treatment|Specification (approval)|Thickness|Electrical insulation|Printed circuits|Holes|Printed-circuit boards|Defects|Mechanical testing|Multiple|Contaminants|Acceptance (approval)|Ageing tests|Bonding|Resistance measurement|Specimen preparation|Capability approval