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IEC 60191-6-12:2002 ed1.0
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
20 стр.
Заменен
Печатная копияЭлектронный (pdf)
188.36 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом
Описание
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.