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IEC 60749-34:2004 ed1.0
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
21 стр.
Заменен
Электронный (pdf)Печатная копия
65.52 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом
Описание
Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.