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IEC 61189-1:1997+AMD1:2001 CSV ed1.1
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
51 стр.
Действует
Печатная копияЭлектронный (pdf)
245.70 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.180 Printed circuits and boards / Печатные схемы и платы
Описание
This series relates to test methods for printed boards and printedboard assemblies, as well as related materials or componentrobustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards andother forms of interconnection structures. The methods are designedto achieve uniformity and reproducibility in the procedures andtest methodologies.This consolidated version consists of the first edition (1997) and its amendment 1 (2001). Therefore, no need to order amendment inaddition to this publication.