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IEC 61191-2:1998 ed1.0
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
49 стр.
Заменен
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245.70 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.240 Mechanical structures for electronic equipment / Механические конструкции электронного оборудования
Описание
Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).