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IEC 62769-4:2021 RLV ed2.0
Field Device Integration (FDI) - Part 4: FDI Packages
248 стр.
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702.71 CHF (включая НДС 20%)
35.100.05 Multilayer. Including International Standardized Profiles / Многоуровневые прикладные системы. Включая международные стандартизованные профили25.040.40 Industrial process measurement and control / Измерение и контроль производственного процесса
IEC 62769-4:2021 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.

IEC 62769-4:2021 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1.