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IEC PAS 61249-3-1:2007 ed1.0
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
31 стр.
Отменен
Электронный (pdf)Печатная копия
384.94 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.180 Printed circuits and boards / Печатные схемы и платы
Описание
Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types