Information from fatigue practitioners active in themicroelectronics area that assess the current state and directionof fatigue/reliability research. 9 peer-reviewed papersprovide:

• Valuable insight into the various methods in use tocharacterize the fatigue/creep interactions within solder undertypical temperature and loading ranges of electronic systems

• Details on the complexity of fatigue/reliability testing ofelectronic component systems

• An excellent overview of the inherent complexities inaccelerated fatigue testing of materials subject to high homologoustemperatures and continual microstructural changes

• Examples of fatigue and creep characterization applied toreliability assessments of actual electronic components.