Ключевые слова:
Testing conditions|Oxygen|Metal coatings|Specimen preparation|Holes|Steam|Mechanical testing|Electric conductors|Thermal-shock tests|Fluxes (materials)|Porosity measurement|Flatness (surface)|Soldering|Thermal testing|Electrical connections|Environmental testing|Visual inspection (testing)|Solderability testing|Ageing tests|Printed circuits|Test equipment|Chemical-resistance tests|Thermal-cycling tests|Peeling tests|Accelerated testing|Adhesion tests|Electrical testing|Printed-circuit boards|Electronic equipment and components