(812) 309-78-59
(495) 223-46-76
BS EN IEC 61190-1-3:2018
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
48 стр.
Действует
Печатная копияПечатное издание
338.69 £ (включая НДС 20%)
Разработчик:
Зарубежные/BSI
ICS:
31.190 Electronic. Including preassembled modules / Электронные компоненты в сборе. Включая предварительно собранные модули
Ключевые слова:
Electronic equipment and components, Electronic engineering, Quality control, Bars (materials), Classification systems, Soldering, Fluxes (materials), Particulate materials, Bonding, Quality assurance, Test methods, Pastes, Electrical connections, Solders