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IEC 60068-2-58:1999 ed2.0
Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
17 стр.
Заменен
Электронный (pdf)Печатная копия
188.36 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.190 Electronic. Including preassembled modules / Электронные компоненты в сборе. Включая предварительно собранные модули19.040 Environmental. Including testing equipment / Климатические испытания. Включая испытательное оборудование
Описание
Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices.The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.