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IEC 60749-22:2002 ed1.0
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
41 стр.
Действует
Электронный (pdf)Печатная копия
229.32 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом
Описание
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements.The contents of the corrigendum of August 2003 have been included in this copy.