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IEC 61189-1:1997 ed1.0
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
37 стр.
Действует
Электронный (pdf)Печатная копия
163.80 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.180 Printed circuits and boards / Печатные схемы и платы
Описание
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.