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IEC 61189-2:1997 ed1.0
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
139 стр.
Заменен
Печатная копияЭлектронный (pdf)
565.12 CHF (включая НДС 20%)
Разработчик:
Зарубежные/IEC
ICS:
31.180 Printed circuits and boards / Печатные схемы и платы
Описание
Provides a catalogue of test methods representing methodologies andprocedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.